It is a manual bonding machine designed for the prototyping and small series that allows high precision and high technology in bonding with a very limited investment.
The machine puts no technological limits to the kind of boards you need to bond. Driven by a touch screen monitor, it can easily be adapted to any kind of lay up.
The highest registration accuracy is obtained by means of the same lay up table of the bigger models with 2 or 4 registration pins.
All heads are individually controlled.
Available also with external lay up table for increased productivity.
MBM-5000 uses the HF Pulse Bonding technology developed by Piergiacomi. This technology allows bonding of thick books up to over 10mm at a very high speed and with a very low energy consumption.
TECHNICAL SPECIFICATIONS:
– Maximum Panel Size: 820x640mm
– Minimum Panel Size: 280x250mm
– Maximum Bonding Thickness: 10mm (optional up to 15)
– Average cycle time for 6 layers: 30 sec
– Maximum settable time: 600 sec
– New job set up time: <2min
– Number of Welding Points: min 4(2+2) – max 8(4+4)
– Maximum power absorbed by 4 welding points: <500 W
– Maximum power absorbed by 8 welding points: <1000 W
– Average power: <300 W
– Supply voltage: 230Vac 50Hz
– Compressed Air Pressure: 0.6-0.7 Mpa
– Compressed Air Consumption: <30 Nl/min
– Overall Dimensions: 186x116x133cm
– Weight: 350 Kg
– Certification: CE compliant.
