| It is a manual bonding machine designed for the prototyping and small series that allows high precision and high technology in bonding with a very limited investment. The machine puts no technological limits to the kind of boards you need to bond.
Driven by a touch screen monitor, it can easily be adapted to any kind of lay up. The highest registration accuracy is obtained by means of the same lay up table of the bigger models with 2 or 4 registration pins.
All heads are individually controlled.
MBM-5000 uses the HF Pulse Bonding technology developed by Piergiacomi. This technology allows bonding of thick books up to over 10mm at a very high speed and with a very low energy consumption.
TECHNICAL SPECIFICATIONS:
- Maximum inner layer dimensions: 820x640mm
- Minimum inner layer dimensions: 280x250mm
- Maximum book thickness: 10mm
- Average cycle time for 6 layers: 30 sec
- Maximum settable time: 600 sec
- Number of welding points SBH1000: min 4(2+2) - max 8(4+4)
- Number of sensors TH100: min 1 - max 4
- Maximum power absorbed by 4 welding points: 500 W
- Maximum power absorbed by 8 welding points: 1000 W
- Average power: 300 W
- Power supply: 230 Volt
- Air compressed consumption: 30 Nl/min
- Maximum pressure air supply: 0.7 Mpa
- Weight: 350 Kg
- Dimensions: 186x116x133cm
CE marked |
